ChipMOS TECHNOLOGIES Inc provides semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers, and foundries. Back-end testing services are offered for high density memory, mixed-signal, and liquid crystal display driver semiconductors. Packaging and testing operations are held in Taiwan, but services are offered to a global client base. Testing solutions are carried out for the complete spectrum of integrated circuits, including digital logic, ASIC, high speed digital, memory, mixed signal, and LCD devices. Customers seeking package solutions are also offered a diverse group of options that include leadframe-based packages, substrate-based packages, and others.